Gas detecting module

ABSTRACT

A gas detecting module is disclosed. A gas-inlet concave and a gas-outlet concave are formed on a sidewall of a base. A gas-inlet-groove region and a gas-outlet-groove region are formed on a surface of the base. The gas-inlet concave is in communication with a gas-inlet groove of the gas-inlet-groove region, and the gas-outlet concave is in communication a gas-outlet groove of the gas-outlet-groove region. The gas-inlet-groove region and the gas-outlet-groove region are covered by a thin film to achieve the effectiveness of laterally inhaling and discharging out gas relative to the gas detecting module.

FIELD OF THE INVENTION

The present disclosure relates to a gas detecting module, and moreparticularly to an extremely thin gas detecting module which is used tointegrate with a portable electronic device or a mobile device.

BACKGROUND OF THE INVENTION

In recent years, people's requirements for the quality of the livingenvironment have gradually increased. Before going out, people arepaying more and more attention to the air quality in addition to theweather information. However, the conventional air quality informationcan only be obtained from the monitoring stations set up by theEnvironmental Protection Administration of the Executive Yuan, and themonitoring stations can only provide the air quality information about alarge area rather than a small area.

Therefore, there is a need to provide a gas detecting module capable ofbeing integrated with a portable electronic device. In this way, peoplecan easily obtain the air quality information through the portableelectronic device.

SUMMARY OF THE INVENTION

An object of the present disclosure provides a gas detecting moduleincluding a base, a micro pump, a driving circuit board and a gas sensorcollaborated to form a modular structure, which can be easily embeddedin a mobile device or a portable electronic device for application.

In accordance with an aspect of the present disclosure, a gas detectingmodule is provided. The gas detecting module includes a base, a micropump, a driving circuit board, a gas sensor and a thin film. The baseincludes a first substrate, a second surface, a plurality of sidewalls,an accommodating space, a gas-inlet-groove region and agas-outlet-groove region. The second surface is opposite to the firstsurface. The plurality of sidewalls extend longitudinally from theperimeter of the first surface to the perimeter of the second surface.One of the sidewalls comprises a gas-inlet concave and a gas-outletconcave recessed therefrom, and the gas-inlet concave and the gas-outletconcave are spaced apart. The accommodating space is recessed from thesecond surface toward the first surface and located in an inner spacedefined by the plurality of sidewalls, and the accommodating space isdivided into a micro-pump-loading region, a detection region and agas-flowing-path region. The micro-pump-loading region and thegas-flowing-path region are in communication with each other through aventing hole, and the detection region and the gas-flowing-path regionare in communication with each other through a communicating opening.The gas-inlet-groove region is recessed the first surface and includes agas-inlet aperture and a gas-inlet groove. The gas-inlet aperture is incommunication with the gas-flowing-path region, and the gas-inlet grooveis in fluid communication with the gas-inlet concave of the sidewall.The gas-outlet-groove region is recessed from the first surface andincludes a gas-outlet aperture and a gas-outlet groove. The gas-outletaperture is in communication with the micro-pump-loading region, and thegas-outlet groove is in fluid communication with the gas-outlet concaveof the sidewall. The micro pump is accommodated within themicro-pump-loading region and covers the gas-outlet aperture. Thedriving circuit board covers and is attached to the second surface ofthe base to form the micro-pump-loading region, the detection region,and the gas-flowing-path region of the accommodating space. Gas isinhaled through the gas-inlet aperture of the gas-inlet-groove regionand discharged out through the gas-outlet aperture of thegas-outlet-groove region to form a gas flowing path. The gas sensor iselectrically connected to the driving circuit board and accommodatedwithin the detection region to detect the gas flowing therethrough. Thethin film covers and is attached to the gas-inlet-groove region and thegas-outlet-groove region. The gas is inhaled through the gas-inletconcave of the sidewall, flows into the gas-inlet-groove region throughthe gas-inlet groove, then flows into the gas flowing path through thegas-inlet aperture, and is discharged out through the gas-outletaperture of the gas-outlet-groove region, so that the gas is laterallydischarged out the gas detecting module through the connection of thegas-outlet concave of the sidewall to the gas-outlet groove of thegas-outlet-groove region. The base, the micro pump, the driving circuitboard, the gas sensor and the thin film are produced by micro materialsto form a modular structure, and the modular structure has a length, awidth and a thickness. The micro pump accelerates the flow of the gas,and the gas is laterally inhaled relative to the gas detecting moduleinto the gas-flowing-path region through the gas-outlet concave of thesidewall, flows into the detection region to be detected, and isdischarged out through the gas-outlet aperture of the gas-outlet-grooveregion by the micro pump, so that the gas is laterally discharged outthe gas detecting module through the connection of the gas-outletconcave of the sidewall to the gas-outlet groove of thegas-outlet-groove region.

The above contents of the present disclosure will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic exterior view illustrating the gas detectingmodule of the present disclosure;

FIG. 1B is a schematic exploded view illustrating the position of thethin film covering the base of the gas detecting module;

FIG. 1C is a schematic exploded view illustrating the associatedcomponents of the gas detecting module;

FIG. 2 is a schematic exterior view illustrating the micro pumpassembled on the base of the gas detecting module

FIG. 3 is a schematic cross-sectional view illustrating a gas flowingpath of the gas detecting module;

FIG. 4 is a schematic cross-sectional view illustrating a gas flowingpath of the gas detecting module and taken from another perspectiveangle;

FIG. 5A is a schematic exploded view illustrating the micro pump of thegas detecting module;

FIG. 5B is a schematic exploded view illustrating the micro pump of thegas detecting module and taken from another perspective angle;

FIG. 6A is a schematic cross-sectional view illustrating the micro pumpof the gas detecting module;

FIG. 6B is a schematic cross-sectional view illustrating the micro pumpof the gas detecting module according to another embodiment;

FIG. 6C to 6E schematically illustrate the actions of the micro pump inFIG. 6A;

FIG. 7A is a schematic cross-sectional view illustrating the MEMS pump;

FIG. 7B is a schematic exploded view illustrating the MEMS pump;

FIG. 8A to 8C schematically illustrate the actions of the MEMS pump;

FIG. 9 is a schematic perspective view illustrating the gas detectingmodule embedded in a mobile device; and

FIG. 10 is a schematic cross-sectional view illustrating the gasdetecting module embedded in a portable electronic device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present disclosure will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this invention arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

Please refer to FIG. 1A to 1C. The present disclosure provides a gasdetecting module including a base 1, a micro pump 2, a driving circuitboard 3, a gas sensor 4 and a thin film 5. Moreover, the base 1, themicro pump 2, the driving circuit board 3, the gas sensor 4 and the thinfilm 5 are produced by micro materials to form a modular structure, andthe modular structure has a length, a width and a thickness. Each of thelength, the width and the thickness of the modular structure ranges from1 mm to 999 mm, 1 μm to 999 μm or 1 nm to 999 nm, but not limitedthereto. In the embodiment, the length, the width and the thickness ofthe modular structure ranges from 1 μm to 999 μm or 1 nm to 999 nm, soas to form the volume of the modular structure, but not limited thereto.The volume can be varied according to the practical requirements.

In the embodiment, the base 1 includes a first surface 11, a secondsurface 12, four sidewalls 13, an accommodating space 14, agas-inlet-groove region 15 and a gas-outlet-groove region 16. The firstsurface 11 and the second surface 12 are two opposite surfaces. The foursidewalls 13 extend longitudinally from the perimeter of the firstsurface 11 to the perimeter of second surface 12. In the embodiment, oneof the sidewalls 13 has a gas-inlet concave 13 a and a gas-outletconcave 13 b, which are recessed therefrom. The gas-inlet concave 13 aand the gas-outlet concave 13 b are spaced apart. The accommodatingspace 14 is recessed from the second surface 12 toward the first surface11 and located in an inner space defined by the plurality of sidewalls13. In the embodiment, the accommodating space 14 is divided into amicro-pump-loading region 14 a, a detection region 14 b and agas-flowing-path region 14 c. Preferably but not exclusively, themicro-pump-loading region 14 a and the gas-flowing-path region 14 c arein communication with each other through a venting hole 14 d. Preferablybut not exclusively, the detection region 14 b and the gas-flowing-pathregion 14 c are in fluid communication with each other through acommunicating opening 14 e.

In the embodiment, the gas-inlet-groove region 15 is recessed from thefirst surface 11, and includes a gas-inlet aperture 15 a and a gas-inletgroove 15 b. The gas-inlet aperture 15 a is in communication with thegas-flowing-path region 14 c. The gas-inlet groove 15 b is connectedbetween the gas-inlet aperture 15 a and the gas-inlet concave 13 a, sothat the gas-inlet aperture 15 a and the gas-inlet concave 13 a are incommunication with each other.

In the embodiment, the gas-outlet-groove region 16 is recessed from thefirst surface 11, and includes a gas-outlet aperture 16 a and agas-outlet groove 16 b. The gas-outlet aperture 16 a is in communicationwith the micro-pump-loading region 14 a. The gas-outlet groove 16 b isconnected between the gas-outlet aperture 16 a and the gas-outletconcave 13 b, so that the gas-outlet aperture 16 a and the gas-outletconcave 13 b are in fluid communication with each other.

Please refer to FIG. 1C and FIG. 2 . In the embodiment, the micro pump 2is accommodated within the micro-pump-loading region 14 a of theaccommodating space 14 and covers the gas-outlet aperture 16 a. Inaddition, the micro pump 2 is electrically connected to the drivingcircuit board 3. The actions of the micro pump 2 are controlled by adriving signal provided by the driving circuit board 3. The drivingsignal (not shown) for the micro pump 2 is provided by the drivingcircuit board 3.

Please further refer to FIG. 1C. In the embodiment, the driving circuitboard 3 covers and is attached to the second surface 12 of the base 2 toform the micro-pump-loading region 14 a, the detection region 14 b andthe gas-flowing-path region 14 c of the accommodating space 14. In that,gas is inhaled through the gas-inlet aperture 15 a of thegas-inlet-groove region 15, and discharged out through the gas-outletaperture 16 a of the gas-outlet-groove region 16 to form a gas flowingpath.

In the embodiment, the gas sensor 4 is positioned and disposed on thedriving circuit board 3, and electrically connected to the drivingcircuit board 3. When the driving circuit board 3 is attached to thesecond surface 12 of the base 1, the gas sensor 4 is accommodatedcorrespondingly within the detection region 14 b of the accommodatingspace 14 to detect the gas flowing therethrough and obtain gasinformation.

In the embodiment, the thin film 5 is attached to the first surface 11of the base 1, and covers the gas-inlet-groove region 15 and thegas-outlet-groove region 16. In that, the gas is inhaled through thegas-inlet concave 13 a of the sidewall 13, flows in the gas-inlet-grooveregion 15 through the gas-inlet groove 15 b, and then flows into the gasflowing path through the gas-inlet aperture 15 a, and is discharged outthrough the gas-outlet aperture 16 a of the gas-outlet-groove region 16.Consequently, the gas is laterally discharged out the gas detectingmodule through the connection of the gas-outlet concave 13 b of thesidewall 13 to the gas-outlet groove 16 b.

From the above descriptions, the micro pump 2 accelerates the flow ofthe gas, and the gas outside the gas detecting module is laterallyinhaled relative to the gas detecting module into the gas-flowing-pathregion 14 c through the gas-outlet concave 13 a of the sidewall 13,flows into the detection region 14 b to be detected by the gas sensor 4disposed therein, and is discharged out through the gas-outlet aperture16 a of the gas-outlet-groove region 16 by the micro pump 2, so that thegas is laterally discharged out the gas detecting module through theconnection of the gas-outlet concave 13 b of the sidewall 13 to thegas-outlet groove 16 b. In the embodiment, the gas sensor 4 is avolatile-organic-compound (VOC) sensor. The present disclosure is notlimited thereto. In other embodiments, the thin film 5 is not attachedto the first surface 11 of the base 1. In that, the gas is inhaled intothe gas flowing path through the gas-inlet aperture 15 a, and dischargedout through the gas-outlet aperture 16 a of the gas-outlet-groove region16 directly, so that the gas is vertically inhaled and discharged outrelative to the gas detecting module. By using the gas detecting moduleof the present disclosure, the gas can be laterally inhaled anddischarged out or vertically inhaled and discharged out relative to thegas detecting module. The applications of the gas detecting module areadjustable according to the practical requirements and not redundantlydescribed herein.

Please refer to FIGS. 3 and 4 . In the embodiment, a driving signal isprovided by the driving circuit board 3 to control the actions of themicro pump 2. When the micro pump 2 is enabled, the gas contained in themicro-pump-loading region 14 a is inhaled and discharged out through thegas-outlet aperture 16 a. At this time, a negative pressure is formed inthe micro-pump-loading region 14 a, so that the gas contained in thegas-flowing-path region 14 c in fluid communication with the ventinghole 14 d flows into the micro-pump-loading region 14 a through theventing hole 14 d. Moreover, the gas is inhaled into thegas-flowing-path region 14 c through the gas-inlet aperture 15 a of thegas-inlet-groove region 15. In addition to the gas in thegas-flowing-path region 14 c flowing into the micro-pump-loading region14 a, a part of the gas also flows into the detection region 14 bthrough the communicating opening 14 e, for the gas sensor 4 disposed inthe detection region 14 b to detect gas information.

Please refer to FIGS. 5A and 5B. In the embodiment, the micro pump 2includes a gas-inlet plate 21, a resonance plate 22, a piezoelectricactuator 23, a first insulation plate 24, a conducting plate 25 and asecond insulation plate 26. The piezoelectric actuator 23 spatiallycorresponds to the resonance plate 22. In the embodiment, the gas-inletplate 21, the resonance plate 22, the piezoelectric actuator 23, thefirst insulation plate 24, the conducting plate 25 and the secondinsulation plate 26 are sequentially stacked on each other.

Please refer to FIGS. 5A and 5B and FIG. 6C. In the embodiment, thegas-inlet plate 21 includes at least one inlet aperture 211, at leastone convergence groove 212 and a convergence chamber 213. Preferably butnot exclusively, there are four inlet apertures 211. The presentdisclosure is not limited thereto. The inlet aperture 211 passes throughthe gas-inlet plate 21 to allow the gas to flow into the micro pump 2 inresponse to the effect of atmospheric pressure. In the embodiment, thegas-inlet plate 21 includes the at least one convergence groove 212. Thenumber and the arrangement of the convergence grooves 212 correspond tothe inlet apertures 211 disposed on another surface. Preferably but notexclusively, there are four inlet apertures 211 and four convergencegrooves 212 spatially corresponding to each other. In the embodiment,the convergence chamber 213 is located at a center of the gas-inletplate 21. Each convergence groove 212 has an end in fluid communicationto the inlet aperture 211 corresponding thereto, and another end influid communication to the convergence chamber 213 located at the centerof the gas-inlet plate 21. Thus, the gas inhaled into the convergencegrooves 212 through the inlet aperture 211 is transported and convergedinto the convergence chamber 213. Preferably but not exclusively, theinlet apertures 211, the convergence grooves 212 and the convergencechamber 213 of the gas-inlet plate 21 are integrally formed into onepiece. In some embodiments, the gas-inlet plate 21 is made of stainlesssteel, but limited thereto. In other embodiments, the depth of theconvergence chamber 213 is the same as the depth of the convergencegroove 212, but not limited thereto.

In the embodiment, the resonance plate 22 is made by a flexiblematerial, but not limited thereto. The resonance plate 22 has a centralaperture 221, which is aligned with the convergence chamber 213 of thegas-inlet plate 21, to allow the gas to flow therethrough. The resonanceplate 22 has a movable part 222, and the movable part 222 surrounds thecentral aperture 221. In some embodiments, the resonance plate 22 ismade by a copper material, but not limited thereto.

In the embodiment, the piezoelectric actuator 23 is collaborativelyformed and assembled by a suspension plate 231, an outer frame 232, atleast one bracket 233 and a piezoelectric element 234. The suspensionplate 231 is a square shape and permitted to undergo a bendingdeformation. The outer frame 232 is disposed around the suspension plate231. The at least one bracket 233 is connected between the suspensionplate 231 and the outer frame 232 for elastically supporting thesuspension plate 231. The piezoelectric element 234 is a square shapeand attached to a first surface of the suspension plate 231. When avoltage is applied to the piezoelectric element 234, the suspensionplate 231 is driven to undergo the bending deformation. Preferably butnot exclusively, a length of a side of the piezoelectric element 234 issmaller than or equal to a length of a side of the suspension plate 231.A plurality of vacant spaces 235 are formed among the suspension plate231, the outer frame 232 and the bracket 233. In addition, thepiezoelectric actuator 23 further includes a bulge 236 disposed on asecond surface of the suspension plate 231, so that the bulge 236 andthe piezoelectric element 234 are disposed on two opposite surfaces ofthe suspension plate 231. When the piezoelectric actuator 23 is enabled,the gas is inhaled from the inlet aperture 211 of the gas-inlet plate21, converged in the convergence chamber 213 through the convergencegroove 212, and passes through the central aperture 221 of the resonanceplate 22, whereby the gas is further transferred through a resonancebetween the piezoelectric actuator 23 and the movable part 222 of theresonance plate 22.

As shown in FIG. 6A, the gas-inlet plate 21, the resonance plate 22, thepiezoelectric actuator 23, the first insulation plate 24, the conductingplate 25 and the second insulation plate 26 are sequentially stacked oneach other. The thickness of the suspension plate 231 of thepiezoelectric actuator 23 is smaller than the thickness of the outerframe 232. When the resonance plate 22 is stacked on the piezoelectricactuator 23, a chamber space 27 is formed among the suspension plate 231and the outer frame 232 of the piezoelectric actuator 23 and theresonance plate 22.

Please refer to FIG. 6B. A micro pump 2 according to another embodimenthas the similar structures, elements and configurations as those of theabove embodiment (FIG. 6A) and is not redundantly described herein.Different from the above embodiment, the suspension plate 231 of thepiezoelectric actuator 23 is formed by stamping and extended away fromthe resonance plate 22, so that the suspension plate 231 and the outerframe 232 are not at the same height level. While the gas-inlet plate21, the resonance plate 22, the piezoelectric actuator 23, the firstinsulation plate 24, the conducting plate 25 and the second insulationplate 26 are sequentially stacked, a chamber distance is formed betweena surface of the suspension plate 231 and the resonance plate 22. Thetransportation efficiency of the micro pump 2 is influenced by thechamber distance, so that it is very important to maintain the chamberdistance fixed for the micro pump 2 to provide a stable transportationefficiency. In this way, the suspension plate 231 of the micro pump 2 isproduced by stamping, so as to make it recessed. Thus, a surface of thesuspension plate 231 and a surface of the outer frame 232 arecollaborated to form a non-coplanar structure. Namely, the surface ofthe suspension plate 231 and the surface of the outer frame 232 arenon-coplanar, and a stepped structure is formed. The surface of thesuspension plate 231 is spaced apart from the surface of the outer frame232. In that, the suspension plate 231 of the piezoelectric actuator 23is recessed to form a space corresponding to the resonance plate 22, sothat the space is collaborated with the resonance plate 231 to make thechamber distance adjustable. The structure of the suspension plate 231of the piezoelectric actuator 23 is directly modified to form a chamberspace by stamping. In this way, the required chamber distance isachieved by adjusting the recessed distance of the suspension plate 231of the piezoelectric actuator 23. Thus, the adjustment of the chamberdistance is simplified in the structural design. Moreover, theadvantages of simplifying the manufacturing process and saving themanufacturing time are achieved.

In order to describe the actions of gas transportation in theabove-mentioned micro pump 2, please refer to FIGS. 6C to 6E. Firstly,please refer to FIG. 6C. When a driving voltage is applied to thepiezoelectric element 234 of the piezoelectric actuator 23, thesuspension plate 231 is driven to undergo the bending deformation andmove upwardly. In that, the volume of the chamber space 27 is expendedrapidly, the internal pressure of the chamber space 27 is decreased toform a negative pressure, and the gas contained in the convergencechamber 213 is inhaled and enters the chamber space 27. At the sametime, the resonance plate 22 is synchronously driven to move upwardlyunder the influence of the resonance principle, and the volume of theconvergence chamber 213 is expended. Since the gas contained theconvergence chamber 213 enters the chamber space 27, it results that theconvergence chamber 213 is also under a negative pressure. Consequently,the gas is inhaled into the convergence chamber 213 through the inletaperture 211 and the convergence groove 212. Please refer to FIG. 6D.When the piezoelectric element 234 drives the suspension plate 231 tomove downwardly, the chamber space 27 is compressed. Similarly, thesuspension plate 231 drives the resonance plate 22 to move downwardlydue to the resonance, and the gas in the chamber space 27 is compressedto move downwardly and further transported upwardly through vacantspaces 235. Consequently, the gas is discharged out of the micro pump 2.Finally, please refer to FIG. 6E. When the suspension plate 231 is movedback to the original position, the resonance plate 22 is further moveddownwardly due to the principle of inertia. At this time, the gascontained in the chamber space 27 is compressed by the resonance plate22 and moved toward the vacant spaces 235, and the volume of theconvergence chamber 213 is expended. Consequently, the gas iscontinuously transported through the inlet apertures 211 and theconvergence grooves 212 and converged in the convergence chamber 213. Byrepeating the above actions shown in FIGS. 6C to 6E, the gas is inhaledfrom the inlet aperture 211 and flows into a flow channel formed by thegas-inlet plate 21 and the resonance plate 22 to generate a pressuregradient, and then the gas is transported upwardly through the vacantspaces 235 to achieve the gas transportation at high speed. The effectof gas transportation of the micro pump 2 is achieved.

The micro pump 2 in the above embodiment can be replaced with amicroelectromechanical systems (MEMS) pump 2 a in another embodiment.Please refer to FIG. 7A and FIG. 7B. The MEMS pump 2 a includes a firstsubstrate 21 a, a first oxidation layer 22 a, a second substrate 23 aand a piezoelectric component 24 a. In addition, the MEMS pump 2 a ofthe present disclosure is produced by the semiconductor manufacturingprocess, such as epitaxy, deposition, lithography and etching in. Thestructure is disassembled. In order to detail show its internalstructure, an exploded view is used to describe it.

In the embodiment, the first substrate 21 a is a Si wafer and has athickness ranging from 150 μm to 400 μm. The first substrate 21 aincludes a plurality of inlet apertures 211 a, a first surface 212 a anda second surface 213 a. In the embodiment, there are four inletapertures 211 a, but the present disclosure is not limited thereto. Eachinlet aperture 211 a penetrates from the second surface 213 a to thefirst surface 212 a. In order to improve the inlet-inflow effect, theplurality of inlet apertures 211 a are tapered-shaped, and the size isdecreased from the second surface 213 a to the first surface 212 a.

The first oxidation layer 22 a is a silicon dioxide (SiO₂) thin film andhas the thickness ranging from 10 μm to 20 μm. The first oxidation layer22 a is stacked on the first surface 212 a of the first substrate 21 a.The first oxidation layer 22 a includes a plurality of convergencechannels 221 a and a convergence chamber 222 a. The numbers and thearrangements of the convergence channels 221 a and the inlet apertures211 a of the first substrate 21 a are corresponding to each other. Inthe embodiment, there are four convergence channels 221 a. First ends ofthe four convergence channels 221 a are in fluid communication with thefour inlet apertures 211 a of the first substrate 21 a, and second endsof the four convergence channels 221 a are in fluid communication withthe convergence chamber 222 a. Thus, after the gas is inhaled throughthe inlet apertures 211 a, the gas flows through the correspondingconvergence channels 221 a and is converged into the convergence chamber222 a.

In the embodiment, the second substrate 23 a is a silicon on insulator(SOI) wafer, and includes a silicon wafer layer 231 a, a secondoxidization layer 232 a and a silicon material layer 233 a. The siliconwafer layer 231 a has a thickness ranging from 10 μm to 20 μm, and hasan actuating portion 2311 a, an outer peripheral portion 2312 a, aplurality of connecting portions 2313 a and a plurality of fluidchannels 2314 a. The actuating portion 2311 a is in a circular shape.The outer peripheral portion 2312 a is in a hollow ring shape anddisposed around the actuating portion 2311 a. The plurality ofconnecting portions 2313 a are connected between the actuating portion2311 a and the outer peripheral portion 2312 a, respectively, so as toconnect the actuating portion 2311 a and the outer peripheral portion2312 a for elastically supporting. The plurality of fluid channels 2314a are disposed around the actuating portion 2311 a and located betweenthe connecting portions 2313 a.

The second oxidation layer 232 a is a silicon monoxide (SiO) layer andhas a thickness ranging from 0.5 μm to 2 μm. The second oxidation layer232 a is formed on the silicon wafer layer 231 a and in a hollow ringshape. A vibration chamber 2321 a is collaboratively defined by thesecond oxidation layer 232 a and the silicon wafer layer 231 a. Thesilicon material layer 233 a is in a circular shape, disposed on thesecond oxidation layer 232 a and bonded to the first oxide layer 22 a.The silicon material layer 233 a is a silicon dioxide (SiO₂) thin filmand has a thickness ranging from 2 μm to 5 μm. In the embodiment, thesilicon material layer 223 a has a through hole 2331 a, a vibrationportion 2332 a, a fixing portion 2333 a, a third surface 2334 a and afourth surface 2335 a. The through hole 2331 a is formed at a center ofthe silicon material layer 233 a. The vibration portion 2332 a isdisposed around the through hole 2331 a and vertically corresponds tothe vibration chamber 2321 a. The fixing portion 2333 a is disposedaround the vibration portion 2332 a and located at a peripheral regionof the silicon material layer 233 a. The silicon material layer 233 a isfixed on the second oxidation layer 232 a through the fixing portion2333 a. The third surface 2334 a is connected to the second oxidationlayer 232 a. The fourth surface 2335 a is connected to the firstoxidation layer 22 a. The piezoelectric component 24 a is stacked on theactuating portion 2311 a of the silicon wafer layer 231 a.

The piezoelectric component 24 a includes a lower electrode layer 241 a,a piezoelectric layer 242 a, an insulation layer 243 a and an upperelectrode layer 244 a. The lower electrode 241 a is stacked on theactuating portion 2311 a of the silicon wafer layer 231 a. Thepiezoelectric layer 242 a is stacked on the lower electrode layer 241 a.The piezoelectric layer 242 a and the lower electrode layer 241 a areelectrically connected through the contact area thereof. In addition,the width of the piezoelectric layer 242 a is less than the width of thelower electrode layer 241 a, so that the lower electrode layer 241 a isnot completely covered by the piezoelectric layer 242 a. The insulationlayer 243 a is stacked on a partial surface of the piezoelectric layer242 a and a partial surface of the lower electrode layer 241 a, which isuncovered by the piezoelectric layer 242 a. The upper electrode layer244 a is stacked on the insulation layer 243 a and a remaining surfaceof the piezoelectric layer 242 a without the insulation layer 243 adisposed thereon, so that the upper electrode layer 244 a is contactedand electrically connected with the piezoelectric layer 242 a. At thesame time, the insulation layer 243 a is used for insulation between theupper electrode layer 244 a and the lower electrode layer 241 a, so asto avoid the short circuit caused by direct contact between the upperelectrode layer 244 a and the lower electrode layer 241 a.

Please refer to FIGS. 8A to 8C. FIGS. 8A to 8C schematically illustratethe actions of the MEMS pump. As shown in FIG. 8A, a driving voltage anda driving signal (not shown) transmitted from the driving circuit board3 are received by the lower electrode layer 241 a and the upperelectrode layer 244 a of the piezoelectric component 24 a, and furthertransmitted to the piezoelectric layer 242 a. After the piezoelectriclayer 242 a receives the driving voltage and the driving signal, thedeformation of the piezoelectric layer 242 a is generated due to theinfluence of the reverse piezoelectric effect. In that, the actuatingportion 2311 a of the silicon wafer layer 231 a is driven to displace.When the piezoelectric component 24 a drives the actuating portion 2311a to move upwardly, the actuating portion 2311 a is separated away fromthe second oxidation layer 232 a to increase the distance therebetween.In that, the volume of the vibration chamber 2321 a of the secondoxidation layer 232 a is expended rapidly, the internal pressure of thevibration chamber 2321 a is decreased to form a negative pressure, andthe gas in the convergence chamber 222 a of the first oxidation layer 22a is inhaled into the vibration chamber 2321 a through the through hole2331 a. Further as shown in FIG. 8B, when the actuating portion 2311 ais driven by the piezoelectric component 24 a to move upwardly, thevibration portion 2332 a of the silicon material layer 233 a is movedupwardly due to the influence of the resonance principle. When thevibration portion 2332 a is moved upwardly, the space of the vibrationchamber 2321 a is compressed and the gas in the vibration chamber 2321 ais pushed to move to the fluid channels 2314 a of the silicon waferlayer 231 a. In that, the gas flows upwardly through the fluid channel2314 a and is discharged out. Moreover, when the vibration portion 2332a is displaced upwardly to compress the vibration chamber 2321 a, thevolume of the convergence chamber 222 a is expended due to thedisplacement of the vibration portion 2332 a, the internal pressure ofthe convergence chamber 222 a is decreased to form a negative pressure,and the gas outside the MEMS pump 2 a is inhaled into the convergencechamber 222 a through the inlet apertures 211 a. As shown in FIG. 8C,when the piezoelectric component 24 a is enabled to drive the actuatingportion 2311 a of the silicon wafer layer 231 a to displace downwardly,the gas in the vibration chamber 2321 a is pushed to flow to the fluidchannels 2314 a, and is discharged out. At the same time, the vibrationportion 2332 a of the silicon material layer 233 a is driven by theactuating portion 2311 a to displace downwardly, and the gas in theconvergence chamber 222 a is compressed to flow to the vibration chamber2321 a through the through hole 2331 a. Thereafter, when thepiezoelectric component 24 a drives the actuating portion 2311 a todisplace upwardly, the volume of the vibration chamber 2321 a is greatlyincreased, and then there is a higher suction force to inhale the gasinto the vibration chamber 2321 a. By repeating the above actions, theactuating portion 2311 a is continuously driven by the piezoelectricelement 24 a to displace upwardly and downwardly, and further to drivethe vibration portion 2332 a to displace upwardly and downwardly. Bychanging the internal pressure of the MEMS pump 2 a, the gas is inhaledand discharged continuously, thereby achieving the actions of the MEMSpump 2 a.

Please refer to FIG. 1A and FIG. 9 . The gas flowing path of the gasdetecting module of the present disclosure is designed to have a lateralinlet and a lateral outlet, so as to facilitate the gas detecting moduleto be embedded in a mobile device 6 for application. Moreover, it isbeneficial of minimizing the overall structural design of the gasdetecting module. Preferably but not exclusively, the gas detectingmodule has the length L ranging from 20 mm to 30 mm, the width W rangingfrom 10 mm to 20 mm, and the thickness H ranging from 1 mm to 6 mm.While the gas detecting module is applied to the mobile device 6, thelateral inlet and the lateral outlet of the gas detecting module arematched to the gas inlet 6 a and gas outlet 6 b disposed on the lateralsidewall of the mobile device 6, so that the gas detecting module of thepresent disclosure can be easily embedded in the mobile device 6 forapplication. Preferably but not exclusively, the mobile device 6 is asmart phone or a smart watch. Please refer to FIG. 10 . In anembodiment, the gas detecting module has the length L ranging from 20 mmto 30 mm, the width W ranging from 10 mm to 20 mm, and the thickness Hranging from 1 mm to 6 mm. The gas detecting module is assembled withina portable electronic device 7. Preferably but not exclusively, theportable electronic device 7 is one selected from the group consistingof a mobile power supply, an air-quality-detection device and an airpurifier.

From the above descriptions, the present disclosure provides a gasdetecting module. In the gas detecting module, the gas-inlet concave andthe gas-outlet concave are recessed on the sidewall of the base, thegas-inlet-groove region and the gas-outlet-groove region are recessedfrom the first surface of the base, the gas-inlet concave is incommunication with the gas-inlet-groove region, the gas-outlet concaveis in communication with the gas-outlet-groove region, and the thin filmcovers and seals the gas-inlet-groove region and the gas-outlet-grooveregion. In that, the effect of transporting the gas through the lateralinlet and the lateral outlet is achieved. Moreover, the micro pump isused to transport the gas. The base, the micro pump, the driving circuitboard and the gas sensor of the present disclosure are assembled to formthe gas detecting module. It facilitates the gas detecting module to beembedded in a mobile device or a portable electronic device easily andmatched with it. The present disclosure includes the industrialapplicability and the inventive steps.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

What is claimed is:
 1. A gas detecting module, comprising: a basecomprising: a first surface; a second surface opposite to the firstsurface; a plurality of sidewalls extending longitudinally from theperimeter of the first surface to the perimeter of the second surface,wherein one of the sidewalls has a gas-inlet concave and a gas-outletconcave recessed therefrom, and the gas-inlet concave and the gas-outletconcave are spaced apart; an accommodating space recessed from thesecond surface toward the first surface and located in an inner spacedefined by the plurality of sidewalls, wherein the accommodating spaceis divided into a micro-pump-loading region, a detection region and agas-flowing-path region, wherein the micro-pump-loading region and thegas-flowing-path region are in communication with each other through aventing hole, and the detection region and the gas-flowing-path regionare in communication with each other through a communicating opening; agas-inlet-groove region recessed on the first surface and comprising agas-inlet aperture and a gas-inlet groove, wherein the gas-inletaperture is in communication with the gas-flowing-path region, and thegas-inlet groove is in fluid communication with the gas-inlet concave ofthe sidewall; and a gas-outlet-groove region recessed on the firstsurface and comprising a gas-outlet aperture and a gas-outlet groove,wherein the gas-outlet aperture is in communication with themicro-pump-loading region, and the gas-outlet groove is in fluidcommunication with the gas-outlet concave of the sidewall; a micro pumpaccommodated within the micro-pump-loading region and covering thegas-outlet aperture; a driving circuit board covering and attached tothe second surface of the base to form the micro-pump-loading region,the detection region, and the gas-flowing-path region of theaccommodating space, wherein gas is inhaled through the gas-inletaperture of the gas-inlet-groove region and discharged out through thegas-outlet aperture of the gas-outlet-groove region to form a gasflowing path; a gas sensor electrically connected to the driving circuitboard and accommodated within the detection region to detect the gasflowing therethrough; and a thin film covering and attached to thegas-inlet-groove region and the gas-outlet-groove region, wherein thegas is inhaled through the gas-inlet concave of the sidewall, flows intothe gas-inlet-groove region through the gas-inlet groove, then flowsinto the gas flowing path through the gas-inlet aperture, and isdischarged out through the gas-outlet aperture of the gas-outlet-grooveregion, so that the gas is laterally discharged out the gas detectingmodule through the connection of the gas-outlet concave of the sidewallto the gas-outlet groove; wherein the base, the micro pump, the drivingcircuit board, the gas sensor and the thin film are produced by micromaterials to form a modular structure, and the modular structure has alength, a width and a thickness, wherein the micro pump accelerates theflow of the gas, and the gas is laterally inhaled relative to the gasdetecting module into the gas-flowing-path region through the gas-inletconcave of the sidewall, flows into the detection region to be detected,and is discharged out through the gas-outlet aperture of thegas-outlet-groove region by the micro pump, so that the gas is laterallydischarged out the gas detecting module through the connection of thegas-outlet concave of the sidewall to the gas-outlet groove.
 2. The gasdetecting module according to claim 1, wherein the length of the modularstructure ranges from 1 μm to 999 μm, the width of the modular structureranges from 1 μm to 999 μm, and the thickness of the modular structureranges from 1 μm to 999 μm.
 3. The gas detecting module according toclaim 1, wherein the length of the modular structure ranges from 1 nm to999 nm, the width of the modular structure ranges from 1 nm to 999 nm,and the thickness of the modular structure ranges from 1 nm to 999 nm.4. The gas detecting module according to claim 1, wherein the length ofthe modular structure ranges from 2 mm to 30 mm, the width of themodular structure ranges from 2 mm to 20 mm, and the thickness of themodular structure ranges from 1 mm to 6 mm.
 5. The gas detecting moduleaccording to claim 1, wherein the gas sensor is avolatile-organic-compound sensor.
 6. The gas detecting module accordingto claim 1, wherein the micro pump comprises: a gas-inlet plate havingat least one inlet aperture, at least one convergence groove and aconvergence chamber, wherein the at least one inlet aperture allows thegas to flow in, the at least one convergence groove is disposedcorresponding to the at least one inlet aperture and is in fluidcommunication with the convergence chamber, and the at least oneconvergence groove guides the gas from the at least one inlet aperturetoward the convergence chamber; a resonance plate having a centralaperture and a movable part, wherein the central aperture is alignedwith the convergence chamber and the movable part surrounds the centralaperture; and a piezoelectric actuator spatially corresponding to theresonance plate; wherein the gas-inlet plate, the resonance plate andthe piezoelectric actuator are stacked sequentially, and a chamber spaceis formed between the resonance plate and the piezoelectric actuator,wherein when the piezoelectric actuator is enabled, the gas is inhaledfrom the inlet aperture of the gas-inlet plate, converged in theconvergence chamber through the convergence groove, and passes throughthe central aperture of the resonance plate, whereby the gas is furthertransferred through a resonance between the piezoelectric actuator andthe movable part of the resonance plate.
 7. The gas detecting moduleaccording to claim 6, wherein the piezoelectric actuator comprises: asuspension plate being a square shape and permitted to undergo a bendingdeformation; an outer frame disposed around the suspension plate; atleast one bracket connected between the suspension plate and the outerframe for elastically supporting the suspension plate; and apiezoelectric element, wherein a length of a side of the piezoelectricelement is smaller than or equal to a length of a side of the suspensionplate, and the piezoelectric element is attached on a surface of thesuspension plate, wherein when a voltage is applied to the piezoelectricelement, the suspension plate is driven to undergo the bendingdeformation.
 8. The gas detecting module according to claim 6, whereinthe piezoelectric actuator comprises: a suspension plate having a bulge;an outer frame disposed around the suspension plate; at least onebracket connected between the suspension board and the outer frame forelastically supporting the suspension plate; and a piezoelectric elementattached to a surface of the suspension plate, wherein when a voltage isapplied to the piezoelectric element, the suspension plate is driven toundergo the bending deformation; wherein the at least one bracket isformed between the suspension plate and the outer frame, and a surfaceof the suspension plate and a surface of the outer frame arecollaborated to form a non-coplanar structure, so that a chamberdistance is maintained between the surface of the suspension plate andthe resonance plate.
 9. The gas detecting module according to claim 6,wherein the micro pump comprises a conducting plate, a first insulationplate and a second insulation plate, and the gas-inlet plate, theresonance plate, the piezoelectric actuator, the first insulation plate,the conducting plate and the second insulation plate are sequentiallystacked on each other.
 10. The gas detecting module according to claim1, wherein the length of the modular structure ranges from 20 mm to 30mm, the width of the modular structure ranges from 10 mm to 20 mm, andthe thickness of the modular structure ranges from 1 mm to 6 mm.
 11. Thegas detecting module according to claim 1, wherein the micro pump is amicroelectromechanical systems (MEMS) pump comprising: a first substratehaving a plurality of inlet apertures, wherein the plurality of inletapertures are tapered-shaped; a first oxidation layer stacked on thefirst substrate, wherein the first oxidation layer comprises a pluralityof convergence channels and a convergence chamber, and the plurality ofconvergence channels are in fluid communication between the convergencechamber and the plurality of inlet apertures; a second substratecombined with the first substrate and comprising: a silicon wafer layer,having: an actuating portion being in a circular shape; an outerperipheral portion being in a hollow ring shape and disposed around theactuating portion; a plurality of connecting portions connected betweenthe actuating portion and the outer peripheral portion, respectively;and a plurality of fluid channels disposed around the actuating portionand located between the connecting portions; a second oxidation layerformed on the silicon wafer layer and being in a hollow ring shape,wherein a vibration chamber is collaboratively defined by the secondoxidation layer and the silicon wafer layer; and a silicon materiallayer being in a circular shape, disposed on the second oxidation layerand bonded to the first oxide layer, having: a through hole formed at acenter of the silicon material layer; a vibration portion disposedaround the through hole; and a fixing portion disposed around thevibration portion; and a piezoelectric component being in a circularshape and stacked on the actuating portion of the silicon wafer layer.12. The gas detecting module according to claim 11, wherein thepiezoelectric component comprises: a lower electrode layer; apiezoelectric layer stacked on the lower electrode layer; an insulationlayer stacked on a partial surface of piezoelectric layer and a partialsurface of the lower electrode layer; and an upper electrode layerstacked on the insulation layer and a remaining surface of thepiezoelectric layer without the insulation layer disposed thereon, so asto electrically connect with piezoelectric layer.